Product Information
Ceramic & Thermal Management Materials
We handle thermally conductive and insulating powders, ceramic substrates, TIM materials, and liquid-cooling and corrosion-control materials for electronics, power semiconductors, AI servers, and data centers.
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Ceramic Substrates & TIM Materials
| English | Japanese | Chinese | Abbreviation / Formula | CAS No. | Typical Applications |
|---|---|---|---|---|---|
| AlN Ceramic Substrate | AlNセラミック基板 | AlN陶瓷基板 | AlN substrate | — | power semiconductors / high-heat-dissipation modules |
| Alumina Ceramic Substrate | アルミナセラミック基板 | 氧化铝陶瓷基板 | Al2O3 substrate | — | power modules / electrically insulating substrates |
| Silicon Nitride Ceramic Substrate | Si3N4セラミック基板 | Si3N4陶瓷基板 | Si3N4 substrate | — | AMB power modules / high-reliability devices |
| Thermally Conductive Epoxy Materials | 熱伝導エポキシ材料 | 导热环氧材料 | — | — | TIM, potting, power-module bonding |
Liquid Cooling & Coolant Media
| English | Japanese | Chinese | Abbreviation / Formula | CAS No. | Typical Applications |
|---|---|---|---|---|---|
| Diethylene Glycol | ジエチレングリコール | 二甘醇 | DEG | 111-46-6 | coolants / solvents / formulation components |
| Ethylene Glycol | エチレングリコール | 乙二醇 | EG | 107-21-1 | water-based coolants / liquid-cooling base fluid |
| Propylene Glycol | プロピレングリコール | 丙二醇 | PG | 57-55-6 | low-toxicity coolants / data-center liquid cooling |
| Triethylene Glycol | トリエチレングリコール | 三甘醇 | TEG | 112-27-6 | cooling / moisture absorption / functional-fluid formulations |
Thermally Conductive & Insulating Powders
| English | Japanese | Chinese | Abbreviation / Formula | CAS No. | Typical Applications |
|---|---|---|---|---|---|
| Aluminum Nitride Powder | 窒化アルミニウム粉末 | 氮化铝粉体 | AlN | 24304-00-5 | high-thermal-conductivity insulating fillers / TIM |
| Hexagonal Boron Nitride | 六方晶窒化ホウ素 | 六方氮化硼 | h-BN | 10043-11-5 | high-thermal-conductivity insulating fillers / TIM |
| Magnesium Oxide | 酸化マグネシウム | 氧化镁 | MgO | 1309-48-4 | thermal conduction / insulating fillers, ceramics |
| Silicon Carbide Powder | 炭化ケイ素粉末 | 碳化硅粉体 | SiC | 409-21-2 | high thermal conductivity / wear-resistant ceramic fillers |
| Silicon Nitride Powder | 窒化ケイ素粉末 | 氮化硅粉体 | Si3N4 | 12033-89-5 | power-device ceramics, insulating materials |
| Zinc Oxide | 酸化亜鉛 | 氧化锌 | ZnO | 1314-13-2 | thermal conduction / electrical-conductivity control, rubber / electronic materials |
| Aluminum Hydroxide | 水酸化アルミニウム | 氢氧化铝 | ATH | 21645-51-2 | Flame-retardant fillers for electronic resins/composites and thermally conductive composites |
| Magnesium Hydroxide | 水酸化マグネシウム | 氢氧化镁 | MDH | 1309-42-8 | Halogen-free flame-retardant and thermally conductive composite fillers |
| Spherical Alumina | 球状アルミナ | 球形氧化铝 | Al2O3 | 1344-28-1 | encapsulation / thermally conductive composite filler; highly filled thermal adhesive / TIM |
| Alumina Powder | アルミナ粉末 | 氧化铝粉体 | Al2O3 | 1344-28-1 | Ceramic separator coatings; thermally conductive fillers, ceramics and insulating materials |
The catalogue shows representative materials and applications. Availability, grades, specifications, regulatory requirements, packaging and logistics should be confirmed for each inquiry.A dash (—) in the CAS No. column indicates that a single CAS number is not appropriate for the product, such as mixtures, composites or specification-dependent products.
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