Product Information
Electronic & Packaging Materials
We handle inorganic fillers, resins, curing agents, coupling agents, heat-resistant and low-dielectric materials for semiconductor and electronic packaging, as well as electronic chemicals for cleaning, photolithography, wet processes, and CMP.
Back to Materials We Handle
CMP Materials & Formulation Additives
| English | Japanese | Chinese | Abbreviation / Formula | CAS No. | Typical Applications |
|---|---|---|---|---|---|
| Citric Acid | クエン酸 | 柠檬酸 | C6H8O7 | 77-92-9 | chelating / cleaning / buffering |
| Ethylenediaminetetraacetic Acid | エチレンジアミン四酢酸 | 乙二胺四乙酸 | EDTA | 60-00-4 | chelating / metal-ion control |
| Glycine | グリシン | 甘氨酸 | C2H5NO2 | 56-40-6 | CMP complexing agent / formulation additives |
| Oxalic Acid | シュウ酸 | 草酸 | C2H2O4 | 144-62-7 | cleaning / chelating / metal treatment |
| Polyethylene Glycol | ポリエチレングリコール | 聚乙二醇 | PEG | 25322-68-3 | Dispersion, wetting, plasticization and formulation aids |
Wet Process Chemicals
| English | Japanese | Chinese | Abbreviation / Formula | CAS No. | Typical Applications |
|---|---|---|---|---|---|
| Acetic Acid | 酢酸 | 醋酸 | AcOH | 64-19-7 | cleaning / buffering / formulations |
Inorganic Fillers & Materials
| English | Japanese | Chinese | Abbreviation / Formula | CAS No. | Typical Applications |
|---|---|---|---|---|---|
| Calcium Carbonate | 炭酸カルシウム | 碳酸钙 | CaCO3 | 471-34-1 | resins / adhesivesgeneral-purpose filler |
| Silica Filler (Amorphous Silica) | シリカフィラー（非晶質シリカ） | 二氧化硅填料（非晶质） | SiO2 | — | EMC, CCL, adhesive and potting fillers |
| Low-alpha Silica | 低α線シリカ | 低α射线二氧化硅 | SiO2 | — | memory devices / high-reliability packaging filler |
| Spherical Silica | 球状シリカ | 球形二氧化硅 | SiO2 | — | EMC, underfill and encapsulant fillers |
| Talc | タルク | 滑石粉 | Mg3Si4O10(OH)2 | 14807-96-6 | Resin reinforcement, dimensional stability and insulating-material fillers |
| Aluminum Hydroxide | 水酸化アルミニウム | 氢氧化铝 | ATH | 21645-51-2 | Flame-retardant fillers for electronic resins/composites and thermally conductive composites |
| Magnesium Hydroxide | 水酸化マグネシウム | 氢氧化镁 | MDH | 1309-42-8 | Halogen-free flame-retardant and thermally conductive composite fillers |
| Spherical Alumina | 球状アルミナ | 球形氧化铝 | Al2O3 | 1344-28-1 | encapsulation / thermally conductive composite filler; highly filled thermal adhesive / TIM |
Resins, Curing Agents & Coupling Agents
| English | Japanese | Chinese | Abbreviation / Formula | CAS No. | Typical Applications |
|---|---|---|---|---|---|
| 2-Methylimidazole | 2-メチルイミダゾール | 2-甲基咪唑 | 2-MI | 693-98-1 | epoxy curing accelerator |
| 3-Aminopropyltriethoxysilane | 3-アミノプロピルトリエトキシシラン | 3-氨基丙基三乙氧基硅烷 | APTES / C9H23NO3Si | 919-30-2 | Coupling agent for adhesion and composites |
| 3-Glycidyloxypropyltrimethoxysilane | 3-グリシジルオキシプロピルトリメトキシシラン | 3-缩水甘油醚氧基丙基三甲氧基硅烷 | GPTMS / C9H20O5Si | 2530-83-8 | filler surface treatment, resin / inorganic interfacial coupling |
| 3-(Trimethoxysilyl)propyl Methacrylate | メタクリル酸3-(トリメトキシシリル)プロピル | 3-(甲基丙烯酰氧基)丙基三甲氧基硅烷 | MPS / C10H20O5Si | 2530-85-0 | acrylic resins / inorganic-filler coupling |
| Bisphenol A | ビスフェノールA | 双酚A | BPA | 80-05-7 | epoxy / raw material for polycarbonate and other resins |
| Bisphenol A Diglycidyl Ether | ビスフェノールAジグリシジルエーテル | 双酚A二缩水甘油醚 | DGEBA / C21H24O4 | 1675-54-3 | Encapsulation adhesives, underfill and insulating adhesives |
| Epichlorohydrin | エピクロロヒドリン | 环氧氯丙烷 | ECH | 106-89-8 | epoxyresins raw materials |
| Hexahydrophthalic Anhydride | ヘキサヒドロ無水フタル酸 | 六氢邻苯二甲酸酐 | HHPA | 85-42-7 | Epoxy curing agent for electronic potting |
| Imidazole | イミダゾール | 咪唑 | IMZ | 288-32-4 | epoxy curing accelerator / intermediates |
| Methylhexahydrophthalic Anhydride | メチルヘキサヒドロ無水フタル酸 | 甲基六氢邻苯二甲酸酐 | MHHPA | 25550-51-0 | Epoxy curing agent for LED/electronic packaging |
| Phenolic Resin | フェノール樹脂 | 酚醛树脂 | PF | 9003-35-4 | EMC, friction/insulation materials and composites |
| 1,6-Hexanediol Diacrylate | 1,6-ヘキサンジオールジアクリレート | 1,6-己二醇二丙烯酸酯 | HDDA | 13048-33-4 | UV adhesives, coatings and crosslinkers |
| 2-Hydroxyethyl Methacrylate | 2-ヒドロキシエチルメタクリレート | 甲基丙烯酸羟乙酯 | HEMA | 868-77-9 | UV resins, adhesives and coatings |
| Glycidyl Methacrylate | グリシジルメタクリレート | 甲基丙烯酸缩水甘油酯 | GMA | 106-91-2 | Epoxy/acrylic modification, electronic adhesives, functional resins and reactive monomers |
| Trimethylolpropane Triacrylate | トリメチロールプロパントリアクリレート | 三羟甲基丙烷三丙烯酸酯 | TMPTA | 15625-89-5 | UV curing and crosslinking |
Cleaning, Photo & Electronic-material Solvents
| English | Japanese | Chinese | Abbreviation / Formula | CAS No. | Typical Applications |
|---|---|---|---|---|---|
| Acetone | アセトン | 丙酮 | C3H6O | 67-64-1 | cleaning, degreasing, solvents |
| Cyclohexanone | シクロヘキサノン | 环己酮 | C6H10O | 108-94-1 | photoresists / resinssolvents |
| Dimethyl Sulfoxide | ジメチルスルホキシド | 二甲基亚砜 | DMSO | 67-68-5 | stripping / cleaning / high-polarity solvent |
| Ethanol | エタノール | 乙醇 | EtOH | 64-17-5 | cleaning / formulation solvents |
| Ethyl 3-Ethoxypropionate | 3-エトキシプロピオン酸エチル | 3-乙氧基丙酸乙酯 | EEP | 763-69-9 | photoresists / electronic-material solvents |
| Ethyl Acetate | 酢酸エチル | 乙酸乙酯 | EA | 141-78-6 | cleaning / formulation solvents |
| Ethyl Lactate | 乳酸エチル | 乳酸乙酯 | EL | 97-64-3 | photoresists / electronic materialsgreen solvent |
| Isopropyl Alcohol | イソプロピルアルコール | 异丙醇 | IPA | 67-63-0 | wafer / electronic-component cleaning |
| Methanol | メタノール | 甲醇 | MeOH | 67-56-1 | cleaning / formulation solvents |
| Methyl Ethyl Ketone | メチルエチルケトン | 甲乙酮 | MEK | 78-93-3 | Electronics and coating-cleaning solvents |
| Methyl Isobutyl Ketone | メチルイソブチルケトン | 甲基异丁基酮 | MIBK | 108-10-1 | photolithography / cleaning / resinssolvents |
| n-Butyl Acetate | 酢酸n-ブチル | 乙酸正丁酯 | nBAc | 123-86-4 | coatings / electronic-material solvents |
| N-Methyl-2-pyrrolidone | N-メチル-2-ピロリドン | N-甲基-2-吡咯烷酮 | NMP | 872-50-4 | cleaning, stripping, electronics / battery applications |
| Propylene Glycol Monomethyl Ether | プロピレングリコールモノメチルエーテル | 丙二醇甲醚 | PGME | 107-98-2 | photoresists / electronic-material solvents |
| Propylene Glycol Monomethyl Ether Acetate | プロピレングリコールモノメチルエーテルアセテート | 丙二醇甲醚醋酸酯 | PGMEA | 108-65-6 | photoresists / electronic-material solvents |
Heat-resistant, Low-dielectric & PI-related Materials
| English | Japanese | Chinese | Abbreviation / Formula | CAS No. | Typical Applications |
|---|---|---|---|---|---|
| 4,4'-(Hexafluoroisopropylidene)diphthalic Anhydride | 4,4'-(ヘキサフルオロイソプロピリデン)ジフタル酸無水物 | 4,4'-(六氟异亚丙基)二邻苯二甲酸酐 | 6FDA / C19H6F6O6 | 1107-00-2 | low-Dk / high-transparency PI monomer |
| 4,4'-Oxydianiline | 4,4'-オキシジアニリン | 4,4'-二氨基二苯醚 | ODA | 101-80-4 | PI diamine monomer |
| 4,4'-Bismaleimidodiphenylmethane | 4,4'-ビスマレイミドジフェニルメタン | 4,4'-双马来酰亚胺基二苯甲烷 | BMI / C21H14N2O4 | 13676-54-5 | high-Tg packaging substrates, heat-resistant resins |
The catalogue shows representative materials and applications. Availability, grades, specifications, regulatory requirements, packaging and logistics should be confirmed for each inquiry.A dash (—) in the CAS No. column indicates that a single CAS number is not appropriate for the product, such as mixtures, composites or specification-dependent products.
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